新一代航电产品的印制板组件互连密度高，微小封装片式器件及高密度细间距芯片大量应用，在产 品组装过程中印制板受到机械应力翘曲而引起器件焊点失效成为痛点问题。本文提出应用应变测试识别组装工 艺风险点，针对性采取工艺优化措施，并采用应变测试量化验证优化效果。试验结果表明，提出的方法能够有 效量化工艺风险，并将组装过程中的产品应变数值降为原来的三分之一，满足了IPC 9704A 标准的要求。
The new generation of avionic products has a high interconnection density of electronic components, and a large number of ball grid array ICs and mini-chips are applied. In the process of product assembly, the failure of the solder joint caused by PCB warping by mechanical stress becomes a pain point. Strain test is applied to identify the risk points of the assembly process, to take specific process optimization measures, and to use strain test to quantitatively verify the optimization results. The results show that the proposed method can effectively quantify the process risk and reduce the product strain in the assembly process to 33%, meeting the requirements of IPC 9704A standard.